Optimized backgrind wafer process minimizes stress effects

Semiconductor International

Volumn 19, Issue 11, 1996, Pages 221-226

  Mendelson, Ron ^a   Diefenderfer, David F ^a   Gumbert, Cynthia Madras ^b   Singh, Baljit ^b  

^a IBM   (United States)

^b ADE Corp   (United States)

Author keywords

Backgrinded wafers; Bow and warp; Non contact capacitance technology

Indexed keywords

EID: 8644289680     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. I. Blech and B. Dang, "Silicon wafer deformation after backside grinding," Solid State Technology, August 1994, pp. 73-76.
2. I. Blech and B. Dang, "Backgrind Processing Using ADE Tools for Control and Analysis," ADE Application Note, No. D2001, 1992.
3. I. Blech and B. Dang, "The Importance of measuring cumulative film stresses and its relationship to wafer backgrinding; Characterizing process interactions," ADE Application Note, No. D3010, 1993.