Numerical analysis of adhesive thickness effect on fracture toughness in adhesive-bonded joints

Key Engineering Materials

Volumn 270-273, Issue II, 2004, Pages 1200-1205

  Choi, Jun Yong ^c   Kim, Hyo Jin ^a   Lim, Jae Kyoo ^a   Mai, Yiu Wing ^b  

^a Chonbuk National University   (South Korea)

^b UNIVERSITY OF SYDNEY   (Australia)

^c NONE

Author keywords

Adhesive Joint; Adhesive Thickness; Finite Element Analysis; Fracture Toughness

Indexed keywords

ADHESION; ADHESIVES; BOND STRENGTH (MATERIALS); CRACKS; ELASTICITY; ENERGY DISSIPATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); PLASTIC DEFORMATION; SURFACES;

ADHESIVE THICKNESS; FRACTURE SURFACE; STRESS FIELDS;

ADHESIVE JOINTS;

EID: 8644268092     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (6)

1. C. Van, Y.W. Mai, Q. Yuan, L. Ye, J. Sun: J. Mech. Sci. Vol. 43 (2001), p. 2091-2102.
2. D.J. Hunston, A.J. Kinloch, S.S. Wang: J. Adhesion Vol. 28 (1989), p. 103-114.
3. A.J. Kinloch, S.J. Shaw: J. Adhesion Vol. 12 (1981), p. 59-77.
4. H. Chai, Int. J. Fract: Vol. 60 (1993), p. 311-326.
5. C. Yan, Y.W. Mai and L. Ye: J. Adhesion Vol. 72 (2000), p. 27-46.
6. M.L. Williams: J. Appl. Mech.-T. ASME 24 (1957), p. 111-1114.