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Volumn 1998-June, Issue , 1998, Pages 217-219
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Integration of low k spin-on polymer (SOP) using electron beam cure for non-etch-back application
a a a b b b c c c c c |
Author keywords
[No Author keywords available]
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Indexed keywords
CURING;
ELECTRON BEAMS;
INTEGRATION;
DIELECTRIC-CONSTANT MEASUREMENTS;
ELECTRON BEAM CURES;
ELECTRON BEAM CURING;
FILM PROPERTIES;
FILM-MODIFICATION;
INTEGRATION PROCESS;
SPIN ON DIELECTRICS;
VIA RESISTANCE;
LOW-K DIELECTRIC;
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EID: 8644262160
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IITC.1998.704903 Document Type: Conference Paper |
Times cited : (3)
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References (8)
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