300mm copper low-κ integration and reliability for 90 and 65nm nodes

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 60-62

  Parikh, Suketu ^a   Naik, Mehul ^a   Hung, Raymond ^a   Dai, Huixiong ^a   Padhi, Deenesh ^a   Zhang, Luke ^a   Pan, Tony ^a   Liu, Kuo Wei ^a   Dixit, Girish ^a   Armacost, Michael ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOTTOM ANTIREFLECTIVE COATING (BARC); STRESS MIGRATION (SM); TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB); VOLTAGE DROP;

COPPER; ELECTROMIGRATION; ELECTROPLATING; ETCHING; EXTRAPOLATION; LITHOGRAPHY; PASSIVATION; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY;

INTERCONNECTION NETWORKS;

EID: 8644260108     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. M. Naik et. al. IITC, p181, 1999.
2. M. Fayolle et al. IITC,p 39, 2002
3. G. Dixit, et al. IITC, p 162 2003.
4. M. Lane, R Rosenberg, MRS Proceedings 2003
5. K. To etal. VLSI symgosium, p109, 2003.