Integrated multidisciplinary design and optimization methodologies in electronics packaging: State-of-the art review

American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES

Volumn , Issue , 2006, Pages

  Suwa, Tohru ^a   Hadim, Hamid ^a  

^a Stevens Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; GRAPHICAL USER INTERFACES; NEURAL NETWORKS; NUMERICAL ANALYSIS; OPTIMIZATION; THERMOMECHANICAL TREATMENT;

COMPUTATION TIME; DESIGN VARIABLES; MULTIDISCIPLINARY DESIGN; TIME INTENSIVE MODELING;

ELECTRONICS PACKAGING;

EID: 85196492683     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2006-15283     Document Type: Conference Paper

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