Forced convective heat transfer of nanofluids in microchannels

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn , Issue , 2006, Pages

  Jung, Jung Yeul ^a   Oh, Hoo Suk ^a   Kwak, Ho Young ^a  

^a Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FORCED CONVECTION; HEAT TRANSFER COEFFICIENTS; HEATING EQUIPMENT; NANOFLUIDICS; POLYSILICON; REYNOLDS NUMBER; TEMPERATURE SENSORS;

INTEGRATED MICROSYSTEM; LOCALIZED HEATERS; POLYSILICON TEMPERATURE SENSORS;

MICROCHANNELS;

EID: 85196478792     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2006-13851     Document Type: Conference Paper

References (21)

1. Tuckerman, D.B. and Pease, R.F.W., 1981, "High-performance heat sinking for VLSI," IEEE Electronic Device Lett., Vol.EDL-2, pp. 126-129.
2. Kishimoto, T. and Ohsaki, T., 1986, "VLSI packaging technique using liquid-cooled channels," IEEE Trans. On Components, Hybrids, and Manufacturing Tech., Vol.CHMT-9, pp. 328-335.
3. Wang, B.X. and Peng, X.F., 1994, "Experimental investigation on forced convection heat transfer through microchannels," Int. J. Heat Mass Transfer, 17, pp. 73-82.
4. Jiang, L., Mikkelson, J., Koo, J., Huber, D., Yao, S., Zhang, L., Zhou, P., Maveety, J.G., Prasher, R., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 2002, "Closed-loop electroosmotic microchannel cooling system for VLSI circuits," IEEE Trans. On Components and Packaging Tech., 25, pp. 347-355.
5. 2 ultra fine particles)," Netsu Bussei (Japan), 4, pp. 227-233.
6. Lee, S., Choi, S.U.S., Li, S., and Eastman, J.A., 1999, "Measuring thermal conductivity of fluid containing oxide nanoparticles," ASME J. Heat Transfer, 121, pp. 280-289.
7. Eastman, J.A., Choi, S.U.S., Li, S., Yu, W., and Thompson, L.J., 2001, "Anomalously increased effective thermal conductivities of ethylene glycol-based nanofluids containing copper nano-particles," Appl. Phys. Lett., 78, pp. 718-720.
8. Pak, B.C., and Cho, Y.I., 1998, "Hydrodynamic and heat transfer study of dispersed fluids with submicron metallic oxide particles," Exp. Heat Transfer, 11, pp. 151-170.
9. Lee, S., and Choi, S.U.S., 1996, "Applications of metallic nanoparticle suspensions in advanced cooling system," Recent Advances in Solid/Structures and Application of Metallic Materials, Lee, Shinpyo, eds., PVP-Vol. 342/MD-Vol. 72, ASME, New York, pp. 227-234.
10. Xuan, Y., and Li, Q., 2003, "Investigation on convective heat transfer and flow features of nanofluids," ASME J. Heat Transfer, 125, pp. 151-155.
11. Wen, D., and Ding, Y., 2004, "Experimental investigation into convective heat transfer of nanofluids at the entrance region under laminar flow conditions," Int. J. Heat Mass Transfer, 47, pp. 5181-5188.
12. Lee, J.Y., Park, H.C., Jung, J.Y., and Kwak, H.Y., 2003, "Bubble nucleation on micro line heaters," ASME J. Heat Transfer, 125(4), pp. 687-692.
13. Jung, J.Y., Lee, J.Y., Park, H.C., and Kwak, H.Y., 2003, "Bubble nucleation on micro line heaters under steady or finite pulse of voltage input," Int. J. Heat Mass Transfer, 46(20), pp. 3897-3907.
14. th International Heat Pipe Symposium, October 12-16, Seogwipo KAL Hotel, Jeju, Korea, pp. 332-337.
15. Jung, J.Y., Byun, K.T., and Kwak, H.Y., 2005, "Proteinaceous bubble and nanoparticle flows in microchannels," Microfluidics and Nanofluidics, 1(2), pp. 177-182.
16. Prasher, R., Bhattacharya, P., and Phelan, P.E., 2005, "Thermal conductivity of Nanoscale colloidal solutions (nanofluids)," Physical Review Letters, 94, p. 025901.
17. Reid, R.C., Prausnitz, J.M., and Poling, B.E., The Properties of Gases & Liquids, forth ed., McGraw-Hill, Singapore, 1986.
18. Wen, D.S., and Ding, Y., 2005, "Effect of particle migration on heat transfer in suspensions of nanoparticles flowing through minichannels," Microfluidics and Nanofluidics, 1, pp. 183-189.
19. Wu, H.Y., and Cheng, P., 2003, "An experimental study of convective heat transfer in silicon microchannels with different surface conditions," Int. J. Heat Mass Transfer, 46, pp. 2547-2556.
20. Tuckeman, D.B., 1984, "Heat-Transfer Microstructures for Integrated Circuits," Ph. D. Thesis, Stanford University.
21. Qu, W., Mala, G.M., and Li, D., 2000, "Heat transfer for water flows in trapezoidal silicon microchannels," Int. J. Heat Mass Transfer, 43, pp. 3925-3936.