Fault Localization in Contact Level by Using Conductive Atomic Force Microscopy

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2003-November, Issue , 2003, Pages 413-418

  Lee, Jon C ^a   Chuang, J H ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CAPACITANCE; DEFECTS; DIELECTRIC FILMS; FAILURE (MECHANICAL); FAILURE ANALYSIS;

CONDUCTIVE ATOMIC FORCE MICROSCOPY; CONTACT LEVELS; CONTACT TYPE; DEEP SUB-MICRON; DEEP-SUB MICRONS; DEFECT ISOLATION; FAULT LOCALIZATION; MICRON RANGE; NANO-METER-SCALE; SCANNING-PROBE MICROSCOPY;

INTEGRATED CIRCUITS;

EID: 85124101349     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa2003p0413     Document Type: Conference Paper

References (6)

1. Jon C. Lee, C. H. Chen, David Su, J. H. Chuang, "Investigation of Sensitivity improvement on Passive Voltage Contrast for Defect Isolation", ESREF Proceedings (2002)
2. Kenneth Krieg, Richard Qi, Douglas Thomson, Greg Bridges, "Electrical Probing and Surface Imaging of Deep Sub-micron Integrated Circuits", ISTFA Proceedings (1999)
3. Kenneth Krieg, Douglas Thomson, Greg Bridges, "Multiple probe Deep Sub-micron Electrical Measurements Using Leading Edge Micro-machined Scanning Probes", ISTFA Proceedings (2001)
4. Andrew N Erickson, "What Can a Failure Analysis Do with an AFM", ISTFA Proceedings (2002)
5. A.Olbrich, B. Ebersberger, C. Boit, "Local electrical thickness mapping of thin oxides with conducting atomic force microscopy" ISTFA Proceedings (2000)
6. Application Notes, Digital Instruments, Veeco Metrology Group 418