Thermally Conductive Polymer Matrix Composites

Springer Series in Advanced Microelectronics

Volumn 30, Issue , 2011, Pages 201-232

  Tong, Xingcun Colin ^a  

^a Laird Technologies   (United States)

Author keywords

Conductive Filler; Effective Thermal Conductivity; Filler Particle; Percolation Threshold; Volume Content

Indexed keywords

EID: 85103540418     PISSN: 14370387     EISSN: 21976643     Source Type: Book Series    
DOI: 10.1007/978-1-4419-7759-5_5     Document Type: Chapter

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