Liquid impingement and phase change for high power density electronic cooling

41st Aerospace Sciences Meeting and Exhibit

Volumn , Issue , 2003, Pages

  Bhunia, Avijit ^a   Cai, Qingjun ^a   Chen, Chung Lung ^a  

^a ROCKWELL SCIENTIFIC COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE ENGINEERING; ATMOSPHERIC TEMPERATURE; CLOSED LOOP SYSTEMS; HEAT FLUX; THERMAL MANAGEMENT (ELECTRONICS);

ATMOSPHERIC CONDITIONS; BACKSIDE COOLING; COMPARATIVE STUDIES; ELECTRONIC DEVICE; HEAT SOURCE TEMPERATURES; HIGH-POWER DENSITY ELECTRONICS; SPRAY IMPINGEMENT COOLING; THIN DIELECTRIC COATINGS;

ELECTRONIC COOLING;

EID: 85088344067     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2514/6.2003-1034     Document Type: Conference Paper

References (16)

1. Tay, A. O., Xue, H., and Yang, C., "Cooling of Electronic Components with Free Jet Impingement Boiling", 2002 IEEE Inter Society Conf. on Thermal Phenomena, Itherm, pp. 387-394, San Diego, CA, 2002.
2. Estes, K. A., Mudawar, I., "Comparison of Twophase Electronic Cooling Using Free Jets and Sprays", Proceed. Intl. Electronics Packaging Conf.-INTERpack'95, v2, pp. 975-987, 1995.
3. Lay, J. H., and Dhir, V. K., "Nucleate Boiling Heat Flux Enhancement on Macro/Micro-structured Surfaces Cooled by an Impinging Jet", J. Enhanced Heat Trans., v 2, pp. 177-188, 1995.
4. Wolf, D. H., Incropera, F. P., and Viskanta, R., "Local Jet Impingement Boiling Heat Transfer", Int. J. Heat Mass Trans., v 39, n 7, pp. 1395-1406, 1996.
5. Ma, C.-F., and Bergles, A. E., "Jet Impingement Nucleate Boiling", Int. J. Heat Mass Trans., v 29, n 8, pp. 1095-1101, 1986.
6. Copeland, D., "Single Phase and Boiling Cooling of a Small Heat Source by Multiple Nozzle Jet Impingement", Int. J. Microelectronic Packaging, v 1, pp. 105-113, 1998.
7. Bhunia, A., Chen, C. L., "Closed Loop Liquid Impingement Cooling System for High Power Density Electronic Devices", IMECE2002-33729, Proceed. IMECE 2002, Int. Mech. Eng. Congress & Expo, New Orleans, LA, 2002.
8. Sawyer, M. L., Jeter, S. M., and Abdel-Khalik, S. I., "A Critical Heat Flux Correlation for Droplet Impact Cooling", Intl. J. Heat Mass Trans., v 40, n 9, pp. 2123-2131, 1997.
9. Amon, C. H., Murthy, J., Yao, S. C., Narumanchi, S., Wu, C. F., Hsieh, C. C., "MEMS-enabled Thermal Management of High-heat-flux devices EDIFICE: Embedded Droplet Impingement for Integrated Cooling of Electronics", Exp. Thermal Fluid Sci., v 25, pp. 231-242, 2001.
10. Bhunia, A., and Chen, C. L., "Liquid Impingement Cooling of High Power Density Silicon Carbide Semiconductor Devices", AIAA2002-0209, 40th AIAA Aerospace Sciences Meeting & Exhibit, Reno, NV, 2002.
11. Chow, L. C., Sehmbey, M. S., Pais, M. R., "High Heat Flux Spray Cooling", Ann. Rev. Heat Trans., v 8, pp. 291-318, 1997.
12. Kearns, D., Du, J.-H., Chen, R.-H., and Chow, L. C., "A Parametric Study of Dielectric Spray Cooling of a Row of Heaters in a Narrow Channel", Proceed. 18th Ann. IEEE Semiconductor Thermal Measurement & Management Symp., San Jose, CA, pp. 164-168, 2002.
13. Lin, Y. R., Sundaram, K. B., and Chow, L. C., "Performance Characteristics of MOSFETS Operating at High Power", SAE2000-01-3622, SAE Power Systems Conf., San Diego, CA, 2000.
14. Mudawar, I., "Assessment of High-heat-flux Thermal Management Schemes", IEEE Intersociety Conf. on Thermal Phenomena, pp. 1-20, 2000.
15. Marcos, A., Chow, L. C., Du, J-H., Lei, S., Rini, D. P., Lindauer, J. J., "Spray Cooling at Low System Pressure", Proceed. 18th Ann. IEEE Semiconductor Thermal Measurement & Management Sym, San Jose, CA, pp. 169-175, 2002.
16. Shaw, M., Waldrop, J., Chandrasekharan, C., Kagalwala, B., Jing, X., Brown, E., Dhir, V. K., and Fabbeo, M., "Enhanced Thermal Management by Direct Water Spray of High-voltage, High Power Devices in a Three-phase, 18HP AC Motor Drive Demonstration", 2002 IEEE Inter Society Conf. on Thermal Phenomena, Itherm, pp. 1007-1014, San Diego, CA, 2002.