Integration of liquid cooling, thermal and thermomechanical design for the lifetime prediction of electrical power modules

SAE Technical Papers

Volumn , Issue , 1998, Pages

  Wilde, Juergen ^a   Staiger, Wolfgang ^a   Thoben, Markus ^b   Schuch, Bernhard ^c   Kilian, Herrmann ^c  

^a DAIMLER AG   (Germany)

^b UNIVERSITY OF BREMEN   (Germany)

^c Telefunken Microelectronic GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; ELECTRONIC DATA INTERCHANGE;

DESIGN AND OPTIMIZATION; DESIGN FOR RELIABILITY; ELECTRONIC MODULES; FINITE ELEMENT PROGRAMS; LIFETIME PREDICTION; SOFTWARE INTERFACES; THERMO-MECHANICAL; THERMO-MECHANICAL DESIGN;

DESIGN;

EID: 85072474213     PISSN: 01487191     EISSN: 26883627     Source Type: Journal    
DOI: 10.4271/980339     Document Type: Conference Paper

References (6)

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2. Brown, S. B., Kim K. H., and Anand L., Int. Journal of Plasticity 5, 1989, pp. 95-130.
3. Püttner, H., Rukwied A., and Wilde J.,: "Lifetime properties of the solder material Sn62PbAg2 (in German)" Proc. 1st European Conference on Electronic Packaging Technology 1994. Deutscher Verlag fuer Schweisstechnik, Duesseldorf, 1994, pp. 150-153.
4. Solomon, H. D., "High and low temperature strain life of a Pb rich solder" J. Electronic Packaging, June 1990, pp. 123-128.
5. Solomon, H. D., "Predicting thermal and mechanical fatigue lifes from isothermal low-cycle data" in Solder Joint Reliability, Ed.: Lau J. H., Van Nostrand Reinhold, New York, 1991.
6. Darveaux, R., "Crack initiation and growth in surface mount solder joints" Proceedings ISHM '93. International Society for Hybrids Microelectronics, pp. 86-97.