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Volumn , Issue , 1998, Pages
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Next generation hemflange adhesive
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Author keywords
[No Author keywords available]
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Indexed keywords
CURING;
TEMPERATURE;
ADHESION CHARACTERISTIC;
ADHESIVE SYSTEMS;
AUTOMOBILE MANUFACTURING;
CURE TEMPERATURE;
LOW TEMPERATURES;
ONE-COMPONENT ADHESIVES;
STRUCTURAL ADHESIVE;
THIN METALS;
INDUCTION HEATING;
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EID: 85072462528
PISSN: 01487191
EISSN: 26883627
Source Type: Journal
DOI: 10.4271/980462 Document Type: Conference Paper |
Times cited : (1)
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References (5)
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