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SAE Technical Papers

Volumn , Issue , 1996, Pages

Integrated barometric pressure sensor with SMD packaging: Example of standardized sensor packaging

(4) Arand, D a Marek, J a Weiblen, K a Lipphardt, U a

a ROBERT BOSCH GMBH (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE; BAROMETERS; BATCH DATA PROCESSING; MOUNTINGS; PRESSURE SENSORS; PRINTED CIRCUIT BOARDS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THICK FILMS; TRIMMING;

BAROMETRIC PRESSURE; BULK SILICON MICROMACHINING; HANDLING EQUIPMENTS; MANUFACTURING TOLERANCES; PRINTED CIRCUIT BOARDS (PCB); PROCESSING CAPABILITY; TEMPERATURE COEFFICIENT; THICK-FILM SUBSTRATES;

CHIP SCALE PACKAGES;

EID: 85072433521 PISSN: 01487191 EISSN: 26883627 Source Type: Journal
DOI: 10.4271/960756 Document Type: Conference Paper

Times cited : (1)

References (7)

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2
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- A Fully Integrated Pressure Sensor
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4
- 0023329777
- IEEE J. Solid-State Circuits, April
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- (1987) CMOS Integrated Silicon Pressure Sensor , vol.22 , pp. 151-156
- Tshihara, T.¹ Suzuki, K.² Suwazono, S.³ Hirata, M.⁴ Tanigawa, H.⁵

5
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- A CMOS Piezoresistive Pressure Sensor with On-Chip Programmable Readout and Calibration Electronics
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- Hammerschmidt, D.¹

6
- 0025497593
- Silicon Pressure Sensor with Integrated CMOS Signal-Conditioning Circuit and Compensation of Temperature Coefficient
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7
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