Comparing substrate solutions for automotive power electronics applications

SAE Technical Papers

Volumn , Issue , 2004, Pages

  Fairchild, M Ray ^a   Myers, John D ^a   Badgett, Jerry L ^a   Berlin, Carl W ^a   Sarma, D H R ^a   Morris, Thomas M ^b   Warren, Harold ^b  

^a DELPHI CORPORATION   (United States)

^b IRC Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; POWER ELECTRONICS; THERMAL CONDUCTIVITY;

AUTOMOTIVE POWER ELECTRONICS; DESIGN VARIATIONS; DIFFERENT SUBSTRATES; HIGH POWER ELECTRONIC APPLICATIONS; HIGH THERMAL CONDUCTIVITY; STRINGENT REQUIREMENT; SUBSTRATE SOLUTION; SUBSTRATE TECHNOLOGY;

SUBSTRATES;

EID: 85072423060     PISSN: 01487191     EISSN: 26883627     Source Type: Journal    
DOI: 10.4271/2004-01-1681     Document Type: Conference Paper

References (2)

1. The National Electronics Manufacturing Initiative (NEMI) Roadmap, December 2000
2. Oak Ridge National Laboratory Review, Vol. 33, No. 3, 2000, Power Electronics: Energy Manager for Hybrid Electric Vehicles.