Analysis of the wire bonding joints of an IGBT module

SAE Technical Papers

Volumn , Issue , 2003, Pages

  Kuriyama, Takayoshi ^a   Inagaki, Nobuaki ^a   Shirai, Mikio ^a   Tada, Masaaki ^b  

^a TOYOTA MOTOR CORPORATION   (Japan)

^b Rd Management Section   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; HYBRID VEHICLES; INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

AL ELECTRODE; AUTOMOBILE PARTS; BONDING SURFACES; CHIP SURFACES; ELECTRIC AND HYBRID VEHICLES; GENERATION MECHANISM; IGBT-MODULES; WIRE BONDING;

WIRE;

EID: 85072410408     PISSN: 01487191     EISSN: 26883627     Source Type: Journal    
DOI: 10.4271/2003-01-1352     Document Type: Conference Paper

References (4)

1. Hamidi A., Beck N., Thomas K., Herr E., "Reliability and lifetime evaluation of different wire bonding technologies for High Power IGBT module" Microelectoronics Reliability 39 (1999) 1153-1158 (Pubitemid 129304848)
2. nd Symposium Microjoining and Assembly Technology in Electronics Feb 1-2, 1996
3. th symposium on Microjoining and Assembly Technology in Electronics Feb 4-5, 1999
4. Onuki Jin, Koizumi Masahiro, Suwa Masateru, "Reliability of Thick Al Wire Bonds in IGBT Modules for Traction Motor Drives" IEEE TRANSACTIONS ON ADVANCED PACKAGING,VOL. 23,NO. 1, FEB 2000