Dual Damascene: A ULSI wiring technology

1991 Proceedings 8th International IEEE VLSI Multilevel Interconnection Conference, VMIC 1991

Volumn , Issue , 1991, Pages 144-152

  Kaanta, Carter W ^a   Bombardier, Susan G ^a   Cote, William J ^a   Hill, William R ^a   Kerszykowski, Gloria ^a   Landis, Howard S ^a   Poindexter, Dan J ^a   Pollard, Curtis W ^a   Ross, Gilbert H ^a   Ryan, James G ^a   Wolff, Stuart ^a   Cronin, John E ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MANUFACTURE; METALS; STUDS (FASTENERS); STUDS (STRUCTURAL MEMBERS); ULSI CIRCUITS;

DUAL DAMASCENE PROCESS; DUAL DAMASCENE STRUCTURES; INTERCONNECT METALS; INTERCONNECT STRUCTURES; INTERCONNECTION TECHNOLOGY; MANUFACTURABILITY; MANUFACTURING IMPLEMENTATIONS; PHOTOLITHOGRAPHIC MASKS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 85056552457     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VMIC.1991.152978     Document Type: Conference Paper

References (8)

1. K. D. Beyer, W. L. Guthrie, S. R. Markarewicz, E. Mendel, W. J. Patrick, K. A. Perry, W. APliskin, J. Riseman, P. MSchaible, and C. L. Standly, "Chem-Mech Polishing Method for Producing Coplanar Metal/INsulator Films on a Substrate, " IBM Corp., US Patent 4, 944, 836, July 31, 1990.
2. K. P. Cheung, C. J. Case, R. Liu, R. J. Schutz, R. S. Wagner, L. F. Tz. Kwakman, D. Huibregtse, H. W. Piekar, and E. H. A. Granneman, Proceedings of 7th Int'l IEEE VLSI Multilevel Interconnection Conference, p. 303, 1990.
3. C. W. Kaanta, W. J. Cote, J. E. Cronin, K. L. Holland, P. I. Lee, and T. M. Wright, "Submicron Wiring Technology with Tungsten and Planarization, " Proceeding of IEDM, p. 209. Dec. 1987.
4. C. W. Kaanta, et al., 1987 IEDM
5. R. R. Uttecht and R. M. Geffken, "A Four-Level-Metal Fully Planarized Interconnect Technology For Dense High Performance Logic and SRAM Applications, " Proceedings of 8th Int'l IEEE VLSI Multilevel Interconnect Conference, June 1991.
6. P. L. Pai, M. Paunovic, and C. H. Ting, "Isoplanar Metallization Process, " 174th Meeting of the Electrochemical Society, Extended Abstracts, p. 362, 1988.
7. S. D. Rossnagel, D. Mikalsen, and J. J. Cuomo, "Lift-Off Magnetron Sputter Deposition", Presentation at 36th American Vacuum Society National Symposium, Boston, Massachusetts, 1989.
8. M. M. Chow, W. L. Guthrie, J. E. Cronin, C. W. Kaanta, B. Luther, K. A. Perry, C. L. Stanley, "Method for Producing Coplanar Multi-Level Metal/Insulator Films on a Surface and for Forming Conductive Lines Simultaneously with Stud Vias, " U. S. Patent 4, 789, 648, Issued Dec. 6, 1988.