Infrared curing of polyimides

Polyimides: Fundamentals and Applications

Volumn , Issue , 2018, Pages 249-264

  Stephanie, John G ^a   Rickerl, Paul G ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL STABILITY; CHIP SCALE PACKAGES; COATINGS; CURING; POLYIMIDES; THERMAL INSULATION;

ELECTRONIC PACKAGING INDUSTRY; HIGH THERMAL STABILITY; INSULATION PROPERTY; LOW DIELECTRIC CONSTANTS; N-METHYL-2-PYRROLIDONE; PYROMELLITIC DIANHYDRIDE; VARIOUS SUBSTRATES; VISCOUS SOLUTION;

SUBSTRATES;

EID: 85052880916     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1201/9780203742945     Document Type: Chapter

References (38)

1. R. Ginsburg and J. R. Susko, in Polyimides: Synthesis, Characterization, and Applications Vol. 1 (K. L. Mittal, ed.), Plenum Press, New York, 1984, pp. 237-247.
2. A. M. Wilson, D. Laks, and S. M. Davis, in Polymer Materials for Electronic Applications, ACS Symposium Series, No. 184, American Chemical Society, Washington, D.C, 1982, p. 139.
3. A. Baise, J. Appl. Polym. Sci. 32: 4043 (1986).
4. C. Feger, Polym. Eng. Sci. 29: 347 (1989).
5. S. Numata, K. Fujisaki, and N. Kinjo, in Polyimides: Synthesis, Characterization, and Applications Vol. 1, (K. L. Mittal, ed.), Plenum Press, New York, 1984, pp. 259-271.
6. J. C. Coburn and M. T. Pottiger, in Advances in Polyimide Science and Technology, (C. Feger, M. M. Khojastech, and M. S. Htoo, eds.), Technomic, Lancaster, PA, 1993, pp. 360-374.
7. S. Isoda, H. Shimada, M. Kochi, and H. Kambe, J. Polym. Scdi. Polym. Phys. Ed. 19: 1293 (1981).
8. M. Kochi, S. Isoda, R. Yokota, I. Mita and H. Kambe, in Polyimides: Synthesis, Characterization, and Applications Vol 2, (K. L. Mittal, ed.), Plenum Press, New York, 1984, pp. 671-681.
9. J. C. Coburn, M. T. Pottiger and C. A. Pryde, Mater. Res. Soc. Symp. Proc, 308, 475 (1993).
10. R. M. Ikeda, J. Polym. Sci. Polym. Lett. Ed. 2: 353 (1966).
11. T. P. Russell, J. Polym. Sci., Part B: Polym. Phys, Ed. 22: 1105 (1984).
12. T. P. Russell, H. Gugger, and J. D. Swalen, J. Polym. Sci., Part B: Polym. Phys. Ed. 21: 1743 (1983).
13. S. E. Molis, R. Saraf, and R. T. Hodgson, ANTEC '91 Proc, Society of Plastics Engineers, Brookfield, CT, 1991, p. 1700.
14. C. E. Diener and J. R. Susko, in Polyimides: Synthesis, Characterization, and Applications Vol. 1, (K. L. Mittal, ed.), Plenum Press, New York, 1984, pp. 353-364.
15. D. H. Lewis, Proc, Society for the Advancement of Materials and Process Engineering, (SAMPE) 39, 1(1994).
16. S. R. King, Proceedings of Nepcon West '86, National Electronic Packaging and Production Conference (Cahners Exposition Group), Des Plaines, IL, 1986, p. 995.
17. A. N. Arslancan and D. K. Flattery, Proceedings of Nepcon West '87, National Electronic Packaging and Production Conference (Cahners Exposition Group), Des Plaines, IL, 1987, p. 375.
18. D. K. Flattery, Infrared Curing of Polymeric Compositions, RTC Infrared Furnace Information Bulletin 1005, Radiant Technology Corporation, Anaheim, CA, 1984.
19. A. J. Chapman in Heat Transfer, Macmillan Publishing Co., New York, 1974, p. 4.
20. D. K. Flattery, Microelectronic Manufacturing and Testing, February, p. 1 (1983).
21. D. J. Pipkin: U.S. Patent 4,345,543, to IBM Corporation (1982).
22. D. J. Pipkin: U.S. Patent 4,442,144, to IBM Corporation (1984).
23. J. G. Stephanie and P. G. Rickerl, ANTEC '91 Proc, Society of Plastics Engineers, Brookfield, CT, 1991, p. 1696.
24. P. G. Rickerl, J. G. Stephanie and P. Slota, Jr., IEEE Trans. CHMT, 12, 690, 1987.
25. M. T. Pottiger, J. C. Coburn, and J. R. Edman, J. Polym. Sci., Part B: Polym. Phys. Ed. 32: 825 (1994).
26. C. Stone, A Study of the Morphology of PMDA-ODA Polyimide Films, Ph.D. Dissertation, North Carolina State University, 1992.
27. B. F. Blumentritt, Polym. Eng. Sci. 18: 1216 (1978).
28. C. Feger, private communication, 1994.
29. M. M. Koton, T. K. Meleshko, V. V. Kudryavtsev, I. V. Gofman, N. P. Kuznetsov, Ye. N. Dergacheva, M. I. Bessonov, Ye. I. Leonov, and A. G. Gorokhov, Polym. Sci. USSR, 27: 905 (1985).
30. H. Pranjoto and D. D. Denton, in Advances in Polyimide Science and Technology, (C. Feger, M. M. Khojasteh, and M. S. Htoo, eds.), Technomic, Lancaster, PA, 1993, pp. 351-359.
31. B. S. Lim, A. S. Nowick, K. W. Lee, and R. Viehbeck, J. Polym. Sci., Part B: Polym. Phys. Ed., 31: 545 (1993).
32. C. I. Croall and T. L. St. Clair, in Advances in Polyimide Science and Technology, (C. Feger, M. M. Khojasteh, and M. S. Htoo, eds.), Technomic, Lancaster, PA, 1993, pp. 618-635.
33. A. K. Saini, C. M. Carlin, and H. H. Patterson, J. Polym. Sci., Part A: Polym. Chem. 31: 2751 (1993).
34. E. Gattiglia and T. P. Russel, J. Polym. Sci., Part B: Polym. Phys. Ed., 27: 2131 (1989).
35. C. A. Pryde, J. Polym. Sci., Part A: Polym. Chem. 27: 711 (1989).
36. T. P. Russell, Polym. Eng. Sci., 24: 345 (1984).
37. P. C. Chen, T. E. Kindl, P. G. Rickerl, M. J. Schadt, and J. G. Stephanie: U.S. Patent 5, 156, 710, to IBM Corporation (1992).
38. P. C. Chen, T. E. Kindl, P. G. Rickerl, M. J. Schadt, and J. G. Stephanie: U.S. Patent 5, 306, 741, to IBM Corporation (1994).