Shear-enhanced yield stress in electrorheological fluids

Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics

Volumn 67, Issue 5, 2003, Pages 4-

  Lau, Kai Chi ^a   Shi, Lihong ^a   Tam, Wing Yim ^a   Sheng, Ping ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85037210955     PISSN: 1063651X     EISSN: None     Source Type: Journal    
DOI: 10.1103/PhysRevE.67.052502     Document Type: Article

References (16)

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14. The effect of Creep-recovery cycle on ER fluids has been reported recently, see, e.g., Y. Otsubo and K. Edamura, J. Colloid Interface Sci. 172, 530 (1995)
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16. The (Formula presented) silca sphere was obtained from Nippon Shokubai and the silicon oil was sample No. 705 from DOW Corning.