Electromigration improvements with titanium underlay and overlay in Al(Cu) metallurgy

1991 Proceedings 8th International IEEE VLSI Multilevel Interconnection Conference, VMIC 1991

Volumn , Issue , 1991, Pages 242-248

  Estabil, J J ^a   Rathore, H S ^a   Levine, E N ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; TITANIUM; VLSI CIRCUITS;

ELECTROMIGRATION DAMAGE; MEDIAN TIME TO FAILURES; RELIABILITY ADVANTAGES; SINGLE LEVEL;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 85033834603     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VMIC.1991.152994     Document Type: Conference Paper

References (12)

1. S. Vaidya, T. T. Sheng, and A. K. Sinha, Appl. Phys. Lett., 36, 1980, p. 464.
2. J. Cho and C. V. Thompson, Appl. Phys. Lett., 54, 1989, p. 2577.
3. J. J. Estabil and H. S. Rathore, Proc. of the 29th IEEE IRPS, March 1991, p. 57.
4. T. Kwok, in Proc. of 4th Int'l IEEE VMIC, 1987, p. 456.
5. T. Kikkawa, N. Endo, T. Yamazaki, and H. Watanabe, in Proc. of 6th Int'l IEEE VMIC, 1989, p. 463.
6. J. S. Jaspal and H. M. Dalai, 19th IEEE IRPS, 1981, p. 238.
7. I. A. Blech, J. Appl. Phys., 47, 1203 (1977).
8. T. Kwok, C. Tan, D. Moy, J. J. Estabil, H. S. Rathore, and S. Basavaiah, in Proc. of 7th Int'l IEEE VMIC, 1990, p. 106.
9. E. N. Levine and J. Kitcher, 22nd IEEE IRPS, 1984, p. 242.
10. J. K. Howard, J. F. White, and P. S. Ho, J. Appl. Phys. 49, p. 4083, (1978).
11. T. Kwok and P. S. Ho, J. Vac. Sci. Technol., A2(2), 1984, p. 241.
12. K. P. Rodbell, P. W. DeHaven, and J. D. Mis, in Proc. of Spring MRS Symp., May 1991.