Noise and delay uncertainty studies for coupled RC interconnects

Proceedings - 12th Annual IEEE International ASIC/SOC Conference

Volumn , Issue , 1999, Pages 3-8

  Kahng, Andrew B ^a   Muddu, Sudhakar ^b   Vidhani, Devendra ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b HEWLETT PACKARD ENTERPRISE   (United States)

^c SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CAPACITANCE; CIRCUIT SIMULATION; SPICE; WIRE;

COUPLED INTERCONNECTS; DELAY UNCERTAINTIES; GLOBAL INTERCONNECTS; HIGH PERFORMANCE SYSTEMS; INTERCONNECT COUPLING NOISE; LOCAL INTERCONNECTS; RC INTERCONNECTS; SPICE SIMULATIONS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 85030259511     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASIC.1999.806462     Document Type: Conference Paper

References (12)

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