Interactive sensor package unit - A multidisciplinary design project

ASEE Annual Conference and Exposition, Conference Proceedings

Volumn , Issue , 2008, Pages

  Liu, Yanfei ^a   Zhao, Jiaxin ^a  

^a INDIANA UNIVERSITY PURDUE UNIVERSITY FORT WAYNE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSESSMENT APPROACHES; CAPSTONE SENIOR DESIGN; DEPARTMENT OF ENGINEERING; INDIANA UNIVERSITY - PURDUE UNIVERSITY FORT WAYNE; MOBILITY MECHANISMS; MULTI-DISCIPLINARY DESIGNS; ORAL PRESENTATIONS; SEMESTER PROJECTS;

ENGINEERING EDUCATION;

EID: 85029113247     PISSN: None     EISSN: 21535965     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Abu-Mulaweh, H., "Engineering capstone senior design", World Transactions on Engineering and Technology Education, Vol.5, No.1, pp. 153-157, 2006
2. Dimitrov, V.; Irish A.; Jones, C.; Kirk S.; Thomas, J. and Welter, D. "Interactive Sensor Package Unit," Capstone Senior Design Report, Department of Engineering, Indiana University - Purdue University Fort Wayne, Dec. 2006
3. Dimitrov, V.; Irish A.; Jones, C.; Kirk S.; Thomas, J. and Welter, D. "Interactive Sensor Package Unit," Capstone Senior Design Report, Department of Engineering, Indiana University - Purdue University Fort Wayne, April 2007
4. Engineering Accreditation Commission, "Criteria for Accrediting Engineering Programs," page 2, March 18, 2007.