Packaging requirements and solutions for CMOS imaging sensors

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 194-198

  Sengupta, K ^a   Sundahl, R ^a   Kawashima, S ^a   Arellano, R ^a   Sklenicka, C ^a   Thompson, D ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARGE COUPLED DEVICES; COSTS; DIES; IMAGE SENSORS; INDUSTRIAL ELECTRONICS; MANUFACTURE; MOISTURE;

CCD IMAGE SENSORS; CMOS IMAGING SENSOR; DEVELOPING MARKETS; MECHANICAL ALIGNMENT; MOISTURE PROTECTION; PACKAGING TECHNOLOGIES; THERMO-MECHANICAL PERFORMANCE; TOLERANCE STACK-UP;

CMOS INTEGRATED CIRCUITS;

EID: 85014995323     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731075     Document Type: Conference Paper

References (3)

1. Kyocera Corporation. Headquartered in Yamashina-Ku, Kyoto, Japan
2. CMOS Sensor White Paper, Rockwell Corp, 1998
3. Kyocera Premolded Package Databook (July, 1996, RevB