Ceramic materials

Ceramic Interconnect Technology Handbook

Volumn , Issue , 2007, Pages 163-197

  Sergent, Jerry E ^a  

^a FAIRFIELD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85013029215     PISSN: None     EISSN: None     Source Type: Book    
DOI: None     Document Type: Chapter

References (8)

1. Sergent, J., Advanced ceramics and composites, in Harper, C., Handbook of Ceramics, Glasses, and Diamonds, McGraw-Hill, New York, 2001, chap.
2. Sergent, J. and Harper, C., Hybrid Microelectronics Handbook, 2nd ed., McGraw- Hill, New York, 1995.
3. Brown, R., Thin film substrates, Handbook of Thin Film Technology, Maissel, L. and Glang, R., Eds., McGraw-Hill, New York, 1971.
4. Garrou, P. and Knudsen, A., Aluminum nitride for microelectronic packaging, Advancing Microelectronics, Vol. 21, No. 1, January–February 1994.
5. Kessel, C.V., Gee, S.A., and Murphy, J., The quality of die attachment and its relationship to stresses and vertical die-cracking, IEEE Components Conference, 1983.
6. Winkleman, A. and Schott, O., Annals of Physics, Vol. 51, 1984.
7. Sergent, J. and Thurman Henderson, H., Double injection in semi-insulators, IEEE Conference on Solid State Physics, 1973.
8. LTCC — Multilayer Ceramic for Wireless and Sensor Applications, Reinhard Kulke, Matthias Rittweger, Peter Uhlig, and Carsten Günner, Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Verlag, Seite 2131-2136, Ausgabe December 2001.