Planarization of Cu and Ta using silica and alumina abrasives - A comparison

Materials Research Society Symposium - Proceedings

Volumn 613, Issue , 2000, Pages E2.4.1-E2.4.6

  Li, Y ^a,c   Ramarajan, S ^b,c   Hariharaputhiran, M ^b,c   Her, Y S ^d   Babu, S V ^b,c  

^a Clarkson University   (United States)

^b Dept Of Chem Eng ^*  (United States)

^c International Center for Gravity Materials Science and Applications   (United States)

^d Ferro Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85009888069     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

1. Chemical-mechanical polishing of Ta
2. Stabilization of alumina slurry for chemical-mechanical polishing of copper
3. Hardness of sub-micrometer abrasive particles and polish rate measurements
4. Chemical processes in glass polishing
5. Effect of pH and ionic strength on the chemical-mechanical polishing of tantalum