Mechanism of Copper Electrodeposition Additive for Via Filling 2-Trench Bottom Acceleration Effect

Journal of The Japan Institute of Electronics Packaging

Volumn 5, Issue 7, 2002, Pages 672-676

  Kondo, Kazuo ^a   Tanaka, Zennosuke ^a   Yamakawa, Norihiro ^a  

^a OKAYAMA UNIVERSITY   (Japan)

Author keywords

Acceleration; Additives; Copper; Damascene Plating; Via Filling

Indexed keywords

EID: 85009648569     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.5.672     Document Type: Article

References (10)

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