Development of Formaldehyde Free Electroless Copper Plating Solution

journal of the japan institute of electronics packaging

Volumn 5, Issue 3, 2002, Pages 252-256

  Itabashi, Takeyuki ^a   Akahoshi, Haruo ^a   Iida, Tadashi ^b   Takai, Eiji ^a   Nishimura, Naoki ^a  

^a HITACHI LTD   (Japan)

^b Hitachi Printed Wiring Board Solutions Co   (Japan)

Author keywords

Cannizarro Reaction; Electroless Copper Plating; Formaldehyde; Glyoxylic Acid

Indexed keywords

EID: 85009647948     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.5.252     Document Type: Article

References (3)

1. H. Akahoshi, K. Murakami, M. Wajima and S. Kawakubo: “ANew Fully Additive Fabrication Process for Printed Wiring Boards”, IEEE Trans. CHMT. Vol. 9, No. 2, pp. 181-187, 1986.
2. J. Darken: “Electroless Copper-an alternative to Formaldehyde”, Trans. Inst. Metal Finish., Vol. 69, No. 2, pp. 66-69, 1991.
3. H. Honma and T. Kobayashi: “Electroless Copper Deposition Process Using Glyoxylic Acid as a Reducing Agent”, J. Electrochem. Soc., Vol. 141, No. 3, pp. 730-733, 1994.