Specific SOI Wafer with Embedded Pattern of Silicon Dioxide and its Application for 2-dimensional Wide Angle Optical Scanner

IEEJ Transactions on Sensors and Micromachines

Volumn 123, Issue 5, 2003, Pages 152-157

  Katashiro, Masahiro ^a   Arima, Michitsugu ^a   Tokuda, Kazunari ^a   Okamura, Toshiro ^a   Matsumoto, Kazuya ^a   Miyajima, Hiroshi ^a  

^a OLYMPUS CORPORATION   (Japan)

Author keywords

bonding; embedded silicon dioxide; MEMS; optical MEMS; SOI wafer

Indexed keywords

EID: 85009644962     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.123.152     Document Type: Article

References (8)

1. N. Asada, M. Takeuchi, V. Vaganov, N. Belov, S. Hout, and I. Sluchak: “Silicon micro-optical scanner”, Tech. Digest, Transducers '99, pp.778-781 (1999)
2. H. Miyajima and M. Ogata: “Silicon micromachined optical scanner for scanning confocal laser microscope”, pp.13-16 (2001) (in Japanese)
3. K. E. Petersen: “Silicon as a Mechanical Material”, Proc. of the IEEE, Vol.70, No.5, pp.420-457 (1982)
4. G. Sinclair and C. Feltner: “Fatigue strength of crystalline solids”, presented at the Symposium on Nature and Origin of Strength of Materials at the 63rd Annual Meeting of ASTM, p.129 (1960)
5. H. Miyajima, et al.: “An Electromagnetic Optical Scanner with Polyimide-Based Hinges”, Tech. Digest, Transducers'99, Vol.1, pp.372-375 (1999)
6. H. Miyajima, et al.: “A durable, shock-resistant electromagnetic optical scanner with polyimide-based hinges”, J. of Microelectromechanical Syst, Vol. 10, No.3, pp.418-424 (2001)
7. H. Toshiyoshi and H. Fujita: “Electrostatic Micro Torsion Mirrors for an Optical Switch Matrix”, J. of MICROELECTROMECHANICAL SYSTEMS, Vol.5, No.4, pp.231-237 (1996)
8. T. Martini, et al.: “Wafer bonding across surface steps in the nanometer range”, Sensors and Actuators, Vol.75, pp.17-23 (1999)