The Characteristics of the New Catalyst Which Used Silver and the Application to the Printed Circuit Board

Journal of The Japan Institute of Electronics Packaging

Volumn 2, Issue 3, 1999, Pages 209-214

  Shimoji, Teruaki ^a   Otsuka, Kuniaki ^a   Aoki, Hiroyuki ^a   Yamagishi, Ayumi ^a  

^a Okuno Chemical Industries Co Ltd   (Japan)

Author keywords

Build up; Catalyst; Colloid; Printed Circuit Bord; Silver

Indexed keywords

EID: 85009643407     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.2.209     Document Type: Article

References (2)

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2. M. Froment, E. Queau, J. R. Martin and G. Strensdoerfer :“Structural and Analytical Characteristics of Adsorbed Pd-Sn Colloids”, J. Electrochem. Soc., Vol. 142, p. 3373. 1995.