Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Method

journal of the japan institute of Electronics Packaging

Volumn 4, Issue 1, 1998, Pages 68-71

  Teramoto, Atsushi ^a   Horiba, Isao ^b  

^a Nagoya Electric Works Co   (Japan)

^b AICHI PREFECTURAL UNIVERSITY   (Japan)

Author keywords

BGA; CSP; Energy Subtraction; Image Process; Inspection; Solder; X Ray

Indexed keywords

EID: 85009635263     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.4.68     Document Type: Article

References (2)

1. T. Muraoka, C. Rice: “Applications of Laser System in Post-Solder Inspection Equipment”, 16th Annual Conference of IEEE Industrial Electronics Society, pp. 805-810, 1990.
2. R. Ray: “Automated Visual Inspection of Solder Bumps”, AT& T Tech. Jour., Vol. 67, Issue 2, pp. 47-60, 1988.