Investigation of Mechanical Properties and Microstructure of Tin-Zinc Eutectic Solder

Journal of The Japan Institute of Electronics Packaging

Volumn 3, Issue 3, 2000, Pages 240-244

  Komatsu, Izuru ^a   Tadauchi, Masahiro ^a   Nakamura, Shin ichi ^a   Teshima, Kouichi ^a   Mukai, Minoru ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Fatigue Life; Lead Free Solder; Mechanical Property; Tin Zinc Eutectic Solder

Indexed keywords

EID: 85009628597     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.3.240     Document Type: Article

References (1)

1. M. Hansen, K. Anderko : “Constitution of Binary Alloys”, McGrawHill Book Co. Inc., Metallurgy and Metallurgical Engineering Series, p. 1218, 1958.