Surface Modification of Insulation Resin for Build-up Process Using TiO2as a Photocatalyst and Its Application to the Metallization

journal of the japan institute of electronics packaging

Volumn 7, Issue 2, 2002, Pages 136-140

  Watanabe, Kenji ^a   Fujimura, Tsubasa ^a   Nishiwaki, Taiji ^a   Tashiro, Katsuhiko ^a   Honma, Hideo ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

Build up Technology; Electroless Cu plating; Surface Modification; Surface Morphology of Resin; TiO2Photocatalyst

Indexed keywords

EID: 85009579155     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.7.136     Document Type: Article

References (0)