Influence of Microstructure on Creep Properties of Solders

journal of the japan institute of Electronics Packaging

Volumn 9, Issue 3, 2006, Pages 162-170

  Nishiyama, Tatsuya ^a   Ogawa, Takeshi ^a   Kohketsu, Hideyuki ^a   Ohsawa, Tadashi ^a   Takahashi, Kyouhei ^a  

^a AOYAMA GAKUIN UNIVERSITY   (Japan)

Author keywords

Creep; Lead Free Solder; Microstructure; Nano Indentation; Size Effect; Solder

Indexed keywords

EID: 85009561672     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.9.162     Document Type: Article

References (2)

1. Symp. Microjoining Assem. Tech. Electron., Vol. 10, pp. 61-64, 2004.
2. R. J. McCabe and M. E. Fine:“The Creep Properties of Precipitation-Strengthened Tin-Based Alloys.” JOM, Vol. 52, No. 52, pp. 33-35, 2000.