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Volumn 3, Issue 1, 2004, Pages 1-

Exploiting Low Entropy to Reduce Wire Delay

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Indexed keywords


EID: 85008048115     PISSN: 15566056     EISSN: None     Source Type: Journal    
DOI: 10.1109/L-CA.2004.7     Document Type: Article
Times cited : (12)

References (12)
  • 4
    • 33646922057 scopus 로고    scopus 로고
    • The Future of Wires
    • April
    • R. Ho, K. Mai, and M. Horowitz, “The Future of Wires,” Proceedings of the IEEE, vol. 89, no. 4, pp. 490–504, April 2001.
    • (2001) Proceedings of the IEEE , vol.89 , Issue.4 , pp. 490-504
    • Ho, R.1    Mai, K.2    Horowitz, M.3
  • 6
    • 85008031236 scopus 로고    scopus 로고
    • MinneSPEC: A New SPEC Bench-mark Workload for Simulation-Based Computer Architecture Research
    • June
    • A. KleinOsowski and D. J. Lilja, “MinneSPEC: A New SPEC Bench-mark Workload for Simulation-Based Computer Architecture Research,” Computer Architecture Letters, vol. 1, June 2002.
    • (2002) Computer Architecture Letters , vol.1
    • KleinOsowski, A.1    Lilja, D.J.2
  • 7
    • 85008008042 scopus 로고    scopus 로고
    • National Technology Roadmap for Semiconductors
    • Semiconductor Industry Association, “National Technology Roadmap for Semiconductors,” 2002.
    • (2002) Semiconductor Industry Association
  • 8
    • 35048834531 scopus 로고
    • Bus-invert coding for low power i/o
    • March
    • M. R. Stan and W. P. Burleson, “Bus-invert coding for low power i/o,” IEEE Transactions on VLSI, vol. 3, no. 1, pp. 49–58, March 1995.
    • (1995) IEEE Transactions on VLSI , vol.3 , Issue.1 , pp. 49-58
    • Stan, M.R.1    Burleson, W.P.2
  • 9
    • 0033221575 scopus 로고    scopus 로고
    • Rethinking Deep-Submicron Circuit Design
    • November
    • D. Sylvester and K. Keutzer, “Rethinking Deep-Submicron Circuit Design,” IEEE Computer, vol. 32, no. 11, pp. 25–33, November 1999.
    • (1999) IEEE Computer , vol.32 , Issue.11 , pp. 25-33
    • Sylvester, D.1    Keutzer, K.2
  • 11
    • 0033689943 scopus 로고    scopus 로고
    • The future of interconnection technology
    • May
    • T. Theis, “The future of interconnection technology,” IBM Journal of Research and Development, vol. 44, no. 3, pp. 379–390, May 2000.
    • (2000) IBM Journal of Research and Development , vol.44 , Issue.3 , pp. 379-390
    • Theis, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.