Newly Development in Transient Liquid Insert Metal Diffusion Bonding Using Alloying Powder

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

Volumn 9, Issue 4, 1991, Pages 550-555

  Nakao, Yoshikuni ^a   Shinozaki, Kenji ^a   Nishimoto, Kazutoshi ^a   Kang, Chung Yun ^b   Shigeta, Haruki ^c  

^a OSAKA UNIVERSITY   (Japan)

^b Pusan National University   (South Korea)

^c JFE STEEL CORPORATION   (Japan)

Author keywords

Alloying powder; Boride; Boron; High temperature; Ni base superalloy; Tensile test; TLP bonding; Wide gap mechanical properties

Indexed keywords

EID: 85007658931     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.9.550     Document Type: Article

References (0)