Analysis of Isothermal Solidification Process on Transient Liquid Insert Metal Diffusion Bonding: Study on Transient Liquid Insert Metal Diffusion Bonding of Ni-base Superalloys (Part 2)

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

Volumn 7, Issue 2, 1989, Pages 213-219

  Nakao, Yoshikuni ^a   Nishimoto, Kazutoshi ^a   Shinozaki, Kenji ^a   Yun, Kang Chung ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Activation energy; Base metal; Boron; Diffusion; Diffusional process; Frequency factor; Insert metal; Isothermal solidification; Liquid phase; Ni B binary system; Ni base superalloy; Ni P binary system; Phosphorous; Transient liquid insert metal diffusion bonding

Indexed keywords

EID: 85004220088     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.7.213     Document Type: Article

References (6)

1. 47-7 (1978), 440.
2. Inco. 713C TLP bonding, 47-3 (1978), 161.
3. Rodney P Elliot: Constitution of Binary Alloys, First Supplement, MaGraw-Hill, 1965, 127.
4. Rodney p Elliot: Constitution of Binary Alloys, First Suppliment, MaGraw-Hill, 1965, 662.
5. Pil. Max Hansenn: Constitution of Binary Alloys, MaGraw Hill, 1958, 1027.
6. 1984, 9, 27.