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EPJ Applied Physics

Volumn 51, Issue 3, 2010, Pages 33203-p1-33203-p5

Ultra high barrier materials for encapsulation of flexible organic electronics

(8) Logothetidis, S a Laskarakis, A a Georgiou, D a Amberg Schwab, S b,d Weber, U b Noller, K c Schmidt, M c Kucukpinar Niarchos E c

a ARISTOTLE UNIVERSITY OF THESSALONIKI (Greece)

b FRAUNHOFER INSTITUTE FOR SILICATE RESEARCH ISC (Germany)

c FRAUNHOFER INSTITUTE FOR PROCESS ENGINEERING AND PACKAGING IVV (Germany)

d Alcan Technology and Management (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84996131960 PISSN: 12860042 EISSN: 12860050 Source Type: Journal
DOI: 10.1051/epjap/2010102 Document Type: Article

Times cited : (14)

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