Hybrid A/D converter for 200°C operation

High-Temperature Electronics

Volumn , Issue , 1998, Pages 790-793

  Sullivan, M R ^a   Toth, J B ^a  

^a Micro Networks Company   (United States)

Author keywords

Aluminum; Bonding; Converters; Gold; Resistors; Substrates; Wire

Indexed keywords

EID: 84988781403     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1109/9780470544884.ch100     Document Type: Chapter

References (6)

1. A.F. Veneruso, “High Temperature Electronics for Geothermal Energy, “IEEE Circuit and Systems Magazine, Vol. 1, No. 3, 1979, p.12.
2. P. R. Prazak, “Hybrid Converters Like it Hot (200°C) and Cold (-55°C)", Electronic Design, Vol.28, No. 23, Nov. 1980, p.125.
3. M. H. Shepard, “Thermal Evaluation of Ceramic Packages”, Micro Networks Qualification Report, Mar. 1979, p. 1.
4. D.W. Palmer, and R.C. Heckman, “Extreme Temperature Range Microelectronics”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.CHMT-1, No. 4, Dec. 1978, pp.334-335.
5. Harris Semiconductor Products Division, Analog Data Book, p.1-5
6. J. D. McBrayer, “High Temperature Complementary Metal Oxide Semiconductor (CMOS)", SAND 79-1487