Use of Non-conductive Film (NCF) with Nano-Sized Filler Particles for Solder Interconnect: Research and Development on NCF Material and Process Characterization

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 923-928

  Nagamatsu, Tatsuo ^a   Honjo, Keiji ^a   Ebisawa, Katsuyuki ^a   Ishimatsu, Tomoyuki ^a   Saito, Takayuki ^a   Mori, Daichi ^a   Motomura, Daisuke ^a   Yagi, Hidekazu ^a  

^a Dexerials Corporation   (United States)

Author keywords

3D TSV; NCF; TCB

Indexed keywords

BONDING; CHARACTERIZATION; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; FILLERS; FLIP CHIP DEVICES; IMAGE RECOGNITION; INTEGRATED CIRCUIT MANUFACTURE; LAMINATING; MATERIALS HANDLING; NETWORK COMPONENTS; PARTICLE SIZE; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; VISCOSITY; WAFER BONDING;

3D-TSV; FINE-PITCH APPLICATION; IMAGE RECOGNITION SYSTEM; PACKAGING TECHNOLOGIES; PROCESS CHARACTERIZATION; RESEARCH AND DEVELOPMENT; THERMAL COMPRESSION BONDING; THERMOSETTING MATERIALS;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84987811452     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.224     Document Type: Conference Paper

References (0)