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Volumn 1992-December, Issue , 1992, Pages 267-270
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ULSI DRAM technology with Ba0.7Sr0.3TiO3 film of 1.3nm equivalent SiO2 thickness and 10-9 A/cm2 leakage current
a a a a a a a a a a a,b a,b a,c |
Author keywords
[No Author keywords available]
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Indexed keywords
BARIUM COMPOUNDS;
CAPACITANCE;
DIELECTRIC MATERIALS;
DYNAMIC RANDOM ACCESS STORAGE;
ELECTRON DEVICES;
LEAKAGE CURRENTS;
LOW-K DIELECTRIC;
SILICA;
STRONTIUM COMPOUNDS;
ULSI CIRCUITS;
APPLIED VOLTAGES;
BA1-XSRXTIO3;
DRAM TECHNOLOGY;
EQUIVALENT SIO2 THICKNESS;
HIGH DIELECTRIC CONSTANT MATERIALS;
HIGH DIELECTRIC CONSTANTS;
LOW-LEAKAGE CURRENT;
STACKED STRUCTURE;
TITANIUM COMPOUNDS;
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EID: 84987409721
PISSN: 01631918
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IEDM.1992.307357 Document Type: Conference Paper |
Times cited : (39)
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References (8)
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