Managing high-frequency signals with MCMs

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 165-171

  Powell, J ^a   Durwood, B ^a   Ruttencutter, P ^a  

^a Maxtek Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROPROCESSOR CHIPS;

DESIGN METHODOLOGY; HIGH FREQUENCY HF; HIGH FREQUENCY SIGNALS; HIGHER FREQUENCIES; MATERIALS AND TECHNOLOGIES; SIGNAL-INTEGRITY PROBLEMS;

MULTICHIP MODULES;

EID: 84986060843     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670774     Document Type: Conference Paper

References (0)