Role of the Interfacial Thermal Barrier in the Effective Thermal Diffusivity/Conductivity of SiC‐Fiber‐Reinforced Reaction‐Bonded Silicon Nitride

Journal of the American Ceramic Society

Volumn 73, Issue 2, 1990, Pages 312-316

  Bhatt, Hemanshu ^a   Donaldson, Kimberly Y ^a   Hasselman, D P H ^a   Bhatt, R T ^b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b NASA GLENN RESEARCH CENTER   (United States)

Author keywords

composites; silicon carbide; silicon nitride; thermal conductivity; thermal resistance

Indexed keywords

EID: 84985080569     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1990.tb06511.x     Document Type: Article

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