A fully packaged D-band MIMO transmitter using high-density flip-chip interconnects on LCP substrate

IEEE MTT-S International Microwave Symposium Digest

Volumn 2016-August, Issue , 2016, Pages

  Li, Sensen ^a   Chi, Taiyun ^a   Park, Jong Seok ^a   Khan, Wasif Tanveer ^a   Wang, Hua ^a   Papapolymerou, John ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

D band; flip chip; liquid crystal polymer (LCP); MIMO transmitter; System on Package (SoP)

Indexed keywords

BUTLER MATRIX; CMOS INTEGRATED CIRCUITS; COST EFFECTIVENESS; FLIP CHIP DEVICES; LARGE SCALE SYSTEMS; LIQUID CRYSTAL POLYMERS; LIQUID CRYSTALS; MILLIMETER WAVES; MIMO SYSTEMS; SUBSTRATES; SYSTEM-ON-PACKAGE; TRANSMITTERS;

FLIP CHIP; FLIP CHIP INTERCONNECTS; LIQUID CRYSTAL POLYMER SUBSTRATE (LCP); MINIMUM FEATURE SIZES; ON-CHIP TRANSFORMER; PACKAGE FABRICATION; PHASED-ARRAY TRANSMITTER; SYSTEM-ON-PACKAGE TECHNOLOGIES;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84984941650     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2016.7540177     Document Type: Conference Paper

References (3)

1. W. Khan, A. Ulusoy, R. Schmid, and J. Papapolymerou, "Characterization of a low-loss and wide-band (DC to 170 GHz) flip-chip interconnect on an organic substrate," in Proc. IEEE Int. Microw. Symp. (IMS), Jun. 2014, pp. 1-4
2. W. Kahn, A. Ulusoy, and J. Papapolymerou, "D-Band characterization of co-planar wave guide and microstrip transmission lines on liquid crystal polymer," IEEE ECTC, May 2013, pp.2304-2309
3. J. Butler, and R. Howe, "Beamforming matrix simplifies design of electronically scanned antennas," Electronic Design, no. 9, pp. 170-173, Apr. 1961