A numerical study of the thermal performance of an impingement heat sink fin shape optimization

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 298-306

  Shah, A ^a   Sammakia, B ^a   Srihari, H ^a   Ramakrishna, Koneru ^b  

^a BINGHAMTON UNIVERSITY   (United States)

^b MOTOROLA INC   (United States)

Author keywords

Costs; Electronics cooling; Heat sinks; Heat transfer; Laboratories; Resistance heating; Shape; Temperature; Thermal conductivity; Thermal resistance

Indexed keywords

COSTS; ELECTRONIC COOLING; FINS (HEAT EXCHANGE); HEAT SINKS; HEAT TRANSFER; LABORATORIES; PRESSURE GRADIENT; SHAPE OPTIMIZATION; TEMPERATURE; THERMAL CONDUCTIVITY;

AIR FLOW-RATE; ELECTRONICS COOLING; HEAT SINK DESIGN; OPERATING TEMPERATURE; PARALLEL PLATES; RESISTANCE-HEATING; SHAPE; THERMAL PERFORMANCE;

HEAT RESISTANCE;

EID: 84983113128     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012471     Document Type: Conference Paper

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