Qualcomm Hexagon DSP: An architecture optimized for mobile multimedia and communications

2013 IEEE Hot Chips 25 Symposium, HCS 2013

Volumn , Issue , 2013, Pages

  Codrescu, Lucian ^a  

^a Technology Qualcomm Technologies Inc ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84979239885     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HOTCHIPS.2013.7478317     Document Type: Conference Paper

References (0)