Gen-3 thermal management technology: Role of microchannels and nanostructures in an embedded cooling paradigm

Journal of Nanotechnology in Engineering and Medicine

Volumn 4, Issue 2, 2013, Pages 1-3

  Bar Cohen, Avram ^a  

^a DEFENSE ADVANCED RESEARCH PROJECTS AGENCY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84974631532     PISSN: 19492944     EISSN: 19492952     Source Type: Journal    
DOI: 10.1115/1.4023898     Document Type: Article

References (5)

1. Bar-Cohen, A., and Bloschock, K., 2012, “Advanced Thermal Management Technologies for Defease Electronics,” Proceedings, SP1E Defense, Security and Seasing Conference, Baltimore, MD, April.
2. Bar-Cohen, A., and Geisler, K. J. L., 2011, “Cooling the Electronic Brain,” Mech. Eng., 133(4), pp. 38-41.
3. Tuckerman, D. B., and Pease, R. F. W., 1981, “High-Performance HeatSinking for VLSI,” IEEE Electron Device Lett., 2(5), pp. 126-129.
4. Yarin, L. P., Mosyak, A., and Hetsroni, G., 2009, Fluid Flow, HeatTransfer, and Boiling in Micro-Channels, Springer, Berlin.
5. Bar-Cohen, A., Sheehan, J., and Rahim, E., 2012, “Two-Phase Thermal Transport in Microgap Channels-Theory, Experimental Results, and Predictive Relations,” Microgravity Sci. Technol., 24, pp. 1-15.