Plasma induced substrate damage in high dose implant resist strip process

International Symposium on Plasma Process-Induced Damage, P2ID, Proceedings

Volumn 2003-January, Issue , 2003, Pages 73-76

  Chan, Bor Wen ^a   Perng, Baw Ching ^a   Sheu, L ^a   Chiu, Yuan Hung ^a   Tao, Han Jan ^a  

^a Adv Module Technol Devmt Division   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

INDUCTIVELY COUPLED PLASMA; MOS DEVICES; PHOTORESISTS;

ELECTRICAL DATA; PHOTORESIST REMOVAL; PLASMA ASHING; PLASMA DAMAGE; PLASMA-INDUCED; SILICON SUBSTRATES; STRIP PROCESS; SUBSTRATE DAMAGE;

SUBSTRATES;

EID: 84973626415     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PPID.2003.1200919     Document Type: Conference Paper

References (4)

1. D. Marshall, B. Freer, and M. Ameen, "Stabilization and Stripping of High Current Implanted Photoresists", Ion Implantation Technology Proceedings, 1998 International Conference on, Vol. 1, 1998, p. 582-585
2. Norton, C.; Marshall, D.; Ameen, M.; Whiteside, D.; Hallock, J.; Becknell, A. Ion Implantation Technology, 2000. Conference on, 2000 p.: 813-816
3. P. Gillespie, R. Mohondro, M. Jones, W. Krisa, and T. Roming, "Photostabilization: Illuminating Photoresist Treatment", Semiconductor International, vol. 8, p. 161, July 1997.
4. J. Shi, M. Kamarehi, D. Shaner, S. S. Rounds, S. Fink, D. Ferris, "Damage Reduction in dry resist stripping system", Solid State Technology, vol. 38, no. 10, p.75, Oct 1995.