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Volumn 19, Issue 8, 1994, Pages 15-21

Copper-Based Metallization in ULSI Structures

(3)  Li, Jian a   Seidel, Tom E a   Mayer, Jim W a  

a NONE

Author keywords

[No Author keywords available]

Indexed keywords


EID: 84972029133     PISSN: 08837694     EISSN: 19381425     Source Type: Journal    
DOI: 10.1557/S0883769400047692     Document Type: Article
Times cited : (102)

References (19)
  • 3
    • 84971856554 scopus 로고
    • edited by D.P. Favreau, Y. Shacham-Diamand, and Y. Horiike Materials Research Society, Pittsburgh, PA
    • A. Kaloyeros, in Advanced Metallization for ULSI Applications in 1993, edited by D.P. Favreau, Y. Shacham-Diamand, and Y. Horiike (Materials Research Society, Pittsburgh, PA, 1994) p. 569.
    • (1994) Advanced Metallization for ULSI Applications in 1993 , pp. 569
    • Kaloyeros, A.1
  • 10
    • 84971856599 scopus 로고
    • edited by D.P. Favreau, Y. Shacham-Diamand, and Y. Horiike Materials Research Society, Pittsburgh, PA
    • K. Suguro and H. Shibata, in Advanced Metallization for ULSI Applications in 1993, edited by D.P. Favreau, Y. Shacham-Diamand, and Y. Horiike (Materials Research Society, Pittsburgh, PA, 1994) p. 28.
    • (1994) Advanced Metallization for ULSI Applications in 1993 , pp. 28
    • Suguro, K.1    Shibata, H.2
  • 11
    • 36449009647 scopus 로고
    • Plasma Etching of Copper Films Using IR Light Irradiation
    • This was also an MRS Spring 1994 Meeting presentation, Symposium B3. ll
    • N. Hosoi and Y. Ohshita, Appl. Phys. Lett. 63 (1993) p. 2703. This was also an MRS Spring 1994 Meeting presentation, Symposium B3.ll, “Plasma Etching of Copper Films Using IR Light Irradiation.”
    • (1993) Appl. Phys. Lett. , vol.63 , pp. 2703
    • Hosoi, N.1    Ohshita, Y.2
  • 14
    • 84971889496 scopus 로고
    • US. Patent No. 277,985
    • J. Li, J.W. Mayer, and E. Colgan, US. Patent No. 5,277,985 (1994).
    • (1994) , Issue.5
    • Li, J.1    Mayer, J.W.2    Colgan, E.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.