Planarized Copper Multilevel Interconnections for VLSI Applications

MRS Bulletin

Volumn 19, Issue 8, 1994, Pages 63-67

  Misawa, N ^a   Ohba, T ^a   Yagi, H ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84971945563     PISSN: 08837694     EISSN: 19381425     Source Type: Journal    
DOI: 10.1557/S088376940004776X     Document Type: Article

References (14)

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