The Plastic Composite Package Provides an Economic Alternative To LSI-VLSI Packaging for High Density Microcircuits

Microelectronics International: An International Journal

Volumn 2, Issue 4, 1985, Pages 5-12

  Mallem, O ^a   Lantaires, J ^a  

^a CIT Alcatel Microelectronics Division ^*  (France)

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Indexed keywords

EID: 84970869407     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/eb044191     Document Type: Review

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