The new underfill materials with high adhesion strength for flip-chip applications

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 369-373

  Kotaka, K ^a   Abe, Y ^a   Homma, Y ^a  

^a NAMICS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); FILLERS; FLIP CHIP DEVICES; GLASS; GLASS TRANSITION; HEAT RESISTANCE; MICROELECTRONICS; SOLDERING; TEMPERATURE;

ACID ANHYDRIDE; ADHESIVE PROPERTIES; FILLER CONTENTS; FLIP CHIP APPLICATIONS; MOISTURE ABSORPTION; RESIN COMPOSITION; SOLDER REFLOW; UNDERFILL MATERIALS;

DELAMINATION;

EID: 84966498862     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704703     Document Type: Conference Paper

References (2)

1. H. Suzuki Denshizairyou. p53 Jan. (1990
2. H. Tabata and N. Kawamoto, Nitto Gihou, 27, (2), 18 (1989