Design of heat-activated reversible integral attachments for product-embedded disassembly

Proceedings - 2nd International Symposium on Environmentally Conscious Design and Inverse Manufacturing

Volumn , Issue , 2001, Pages 360-365

  Li, Ying ^a   Saitou, K ^a   Kikuchi, N ^a   Skerlos, S J ^a   Papalambros, P Y ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLIANT MECHANISMS; DESIGN; ECODESIGN; FINITE ELEMENT METHOD; HOMOGENIZATION METHOD; INJECTION MOLDING; MANUFACTURE; MECHANICAL VARIABLES MEASUREMENT; MECHANISMS; STRUCTURAL OPTIMIZATION; THERMAL EXPANSION; TOPOLOGY;

CONVENTIONAL INJECTION MOLDING; DESIGN FOR ASSEMBLY; HOMOGENIZATION DESIGN METHOD; MANUFACTURABILITY; MATERIAL RECYCLING; OPTIMAL TOPOLOGIES; PROTOTYPE DESIGNS; STRUCTURAL TOPOLOGIES;

PRODUCT DESIGN;

EID: 84963705497     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECODIM.2001.992381     Document Type: Conference Paper

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20. th International conference on ECO materials.